Application of Nanoindentation to Characterize Fracture in ILD Films Used in the BEOL

It is of importance to understand cracking behavior in low dielectric constant, low modulus materials. Nanoindentation method is presented as a tool to estimate the critical film thickness, thickness above which spontaneous cracking could occur, for ILD films used in the BEOL. The critical film thickness was then used to calculate cohesive energies and fracture toughness of the films. Materials were investigated using nanoindentation combined with AFM imaging. The results were compared to data acquired by four point bend methods.

By: Eva E. Simonyi; E. Liniger; M. Lane; Q. Lin; C. D. Dimitrakopoulos; C. Tyberg

Published in: RC23545 in 2005


This Research Report is available. This report has been submitted for publication outside of IBM and will probably be copyrighted if accepted for publication. It has been issued as a Research Report for early dissemination of its contents. In view of the transfer of copyright to the outside publisher, its distribution outside of IBM prior to publication should be limited to peer communications and specific requests. After outside publication, requests should be filled only by reprints or legally obtained copies of the article (e.g., payment of royalties). I have read and understand this notice and am a member of the scientific community outside or inside of IBM seeking a single copy only.


Questions about this service can be mailed to .