Passive Self-Aligned, Low Cost Packaging of Semiconductor Laser Arrays on Si Motherboard

Copyright [©] (1995) by IEEE. Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distrubuted for profit. To copy otherwise, to republish, to post on servers, or to redistribute to lists, requires prior specific permission and/or a fee.

A passive self-aligned packaging technique for semiconductor laser arrays has been realized. Alignment trenches on the laser chip are used for self-alignment during flip-chip mounting on a Silicon motherboard. The use of the etched Si sidewalls for alignment results in a self-positioning effect, reducing the necessary device placing precision, and allows for large tolerances in the motherboard processing, resulting in low packaging costs. A module with 4 lasers and integrated monitor diodes has been pigtailed. Optical mounting excess and differential losses between the channels are $<$0.5 dB.

By: W. Hunziker (ETH, Zurich, Switz.), W. Vogt (ETH, Zurich, Switz.), H. Melchior (ETH, Zurich, Switz.), P. Buchmann and P. Vettiger

Published in: IEEE Photonics Technology Letters, volume 7, (no 11), pages 1324-6 in 1995

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