Losses Caused by Roughness of Metallization in Printed-Circuit Boards

In this paper the effect of metal roughness on the total loss, the extracted tan, and signal integrity of typical interconnections found in printed-circuit boards is extracted from measurements on three different materials. The differing characteristics of the roughened metal cross sections is highlighted, and a simplified, practical, two-dimensional, causal, broadband modeling methodology is shown.

By: A. Deutsch; C. Surovic; R. Krabbenhoft; G. V. Kopcsay; B. Chamberlin

Published in: RC23625 in 2005


This Research Report is available. This report has been submitted for publication outside of IBM and will probably be copyrighted if accepted for publication. It has been issued as a Research Report for early dissemination of its contents. In view of the transfer of copyright to the outside publisher, its distribution outside of IBM prior to publication should be limited to peer communications and specific requests. After outside publication, requests should be filled only by reprints or legally obtained copies of the article (e.g., payment of royalties). I have read and understand this notice and am a member of the scientific community outside or inside of IBM seeking a single copy only.


Questions about this service can be mailed to reports@us.ibm.com .