Fabrication of a Silicon-Pyrex-Silicon Stack by AC Anodic Bonding

This paper reports a new mounting technique for bonding silicon-Pyrex-silicon stacks based on anodic bonding and alternative current excitation. It is mechanically stable enough that no special precautions have to be taken to manipulate the stack and it can also withstand further reactive ion and wet chemical etching processes. This technique was optimized to be independent of various modifications of the stack dimensions or bonding parameters (e.g. temperature, voltage, contact).

By: M. Despont, H. Gross, F. Arrouy, C. Stebler and U. Staufer

Published in: Sensors and Actuators A, volume 55, (no ), pages 219-24 in 1996

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