High-Resolution Patterning and Transfer of Thin PDMS Films: Fabrication of Hybrid Self-Sealing 3D Microfluidic Systems

This paper describes the fabrication procedure for a hybrid elastomer-Si structure. The procedure comprises embossing and curing a thin film in poly(dimethylsiloxane) (PDMS) with vias in the 30-micrometer regime, followed by a double transfer, first to an intermediate substrate and then, with registration, to the micromachined Si structure. A well-defined adhesion between the PDMS film, the mold, the transfer substrate and the target wafer is key to each successful transfer, and plays a crucial role in the efficient removal of nanometer-thick residual membranes that systematically obstruct vias formed by embossing. Inhibition of the cross-linking of the PDMS pre-polymer in the presence of SU-8 photoresist was observed, and overcome for our case. We fabricated hybrid PDMS-Si microfluidic systems that can be sealed reversibly on any smooth and flat substrate, and filled with different solutions.

By: U. Kloter, H. Schmid, H. Wolf, B. Michel, and D. Juncker

Published in: 17th IEEE International Conference on Micro Electro Mechanical System (MEMS 2004) Technical Digest. Piscataway, NJ, , IEEE. , p.745-8 in 2004

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