Flip-Chip Interconnections - Past, Present and Future

In this chapter, the recent progress of flip-chip assembly processes is presented with ceramic substrates and organic laminates, including the new bumping technologies such as C4NP and Cu pillar bumping. In the following, various reliability challenges of Pb-free, flip-chip applications are extensively discussed along with possible solutions for specific applications.

By: Sung K. Kang; Da-Yuan Shih; William E. Bernier

Published in: RC24940 in 2010


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